With the rapid development of the times, new materials, new structures, and new technologies have been born one after another, which has contributed to the development of power electronics technology. In particular, power electronic technology is undergoing rapid changes in devices, converter circuits, control technology, etc. From single function to multi-function, from simple operation to parallel processing of complex operations, power electronic devices are continuously miniaturized and integrated. The area heat generation is amazing, so higher requirements are put forward on the performance of the heat sink. Therefore, the research and development of heat dissipation methods for power electronic devices has become an indispensable key link.
1. How to choose radiation method?

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Common cooling methods are: active cooling and passive cooling;
Active heat dissipation: external force promotes fluid circulation to take away heat.
Heat dissipation methods include: air cooling, water cooling, heat pipe, heat pipe + air cooling, water cooling, and efficient heat dissipation coating.
Passive heat dissipation: It uses physics itself to circulate heat naturally through heat conduction, heat transfer, and heat radiation.
2. Comparison of common radiators

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Cooling method Comparison item	Aluminum (copper) profile radiator	Heat pipe radiator	Water-cooled radiator
Thermal resistance, heat dissipation capacity	Poor, the minimum thermal resistance is 0.01℃/W under 6m/s wind speed	Very strong, up to 0.01℃/W under 6m/s wind speed	Very strong, thermal resistance can reach 0.01℃/W
Material weight	Bulk, thermal resistance 0.03℃/W product up to 12kg	Lighter, more than 50% lighter than the profile under the same weight	Water pumps& water treatment equipments required
Relationship with the whole machine structure and thermal design	The whole machine is heavy and bulky	The structure is flexible, which is conducive to the optimization of the whole machine structure and thermal design	The whole must be equipped with a water treatment device, which is not convenient to use
Cost performance	poor	superior	Large investment

3. Choose the suitable radiator

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1. Factors to be considered:
① Thermal power consumption: depends on the power device thermal loss selection;
② External dimensions: depends on the power structure design;
③ Use environment: storage conditions of the whole equipment, indoor and outdoor; whether the environment is clean or bad;
④ Cost performance: aluminum profile ⑤ Follow-up maintenance: mainly involves the maintenance of the fan; water cooling requires regular maintenance of the water cooling device, pump, and water;
2. Selection scheme

Types	Profile radiator			Heat pipe radiator		Water cooling
Product	Aluminum radiator	Copper profile radiator	Profile loop radiator	Aluminum plate	Copper substrate	Water-cooled plate	Water-cooled device
Scope of application	Low power consumption	Low power consumption	Large power range	Low power consumption	High power consumption	Low power consumption	High power consumption
Cost performance	general	low	Higher	high	Higher	Higher	low
Size	Size can be customized	Not recommended	requested	custom made	custom made	custom made	custom made
Cooling method	Forced air cooling	------	Choose air cooling	Choose air cooling	Choose air cooling	Choose air cooling	-------